Manufacture of a Ball Grid Array Packaging
The manufacture begins with the basic circuit board, primed and printed. This printed circuit board for BGA has pads made of copper and these are arranged in the grid pattern that the solder balls are designed to have.
After the solder balls have been precisely arranged on the surface of the printed circuit board, the soldering process would begin. Surface mount soldering would proceed through reflow soldering (with the aid of a reflow oven that uses infrared or vapors as the heat source). At this point, the metal alloy balls would melt due to extreme temperatures. As the whole assembly cools, the solder balls will solidify and the package will become firmly affixed to the circuit board.
