The Advantages of Ball Grid Array
A Ball Grid Array makes precise alignment and mounting possible. Before the Ball grid Array packaging, a single circuit board would sometimes require hundreds of pins. This presented a lot of positioning problems. When the assembly was heated, adjacent pins would sometimes get soldered together or form unplanned bridges.
One other advantage of Ball Grid Array packaging over other types of packaging involves heat conduction. A Ball Grid Array has less resistance to heat so heat flows readily from the mounted circuit components to the printed circuit board. This reduces the risk of overheating.
Finally, a Ball Grid Array assembly's contact points (point of contact between the surface solder balls and the printed circuit board itself is not readily apparent. This means greater data and application security.
Of course, a Ball Grid Array packaged integrated circuit is rather inflexible. Rigorous stress on the integrated circuit may cause the balls or the contact points to break off.
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