Capacitors Blog

Suntan offer full kinds of Trimming Potentiometer as below. Please check http: / / http://www.suntan.com.hk/Trimming-Potentiometers/ for data sheet freely.

TSR-3006 - Rectangular Trimming Potentiometer
TSR-3323 - 4 Terminal Square Trimming Potentiometer
TSR-3296 - 5 Terminal Square Trimming Potentiometer
TSR-3362 - 7 Terminal Square Trimming Potentiometer
TSR-3386 - 8 Terminal Square Trimming Potentiometer
TSR-3329 - Circularity Trimming Potentiometer
TSR-3266 - 5 Terminal Square Trimming Potentiometer
TSR-3318 - 6mm Phenolic Round Trimming Potentiometer
TSR-3306 - 6mm Cermet Round Trimming Potentiometer
TSR-3309 - 9mm Round Trimming Potentiometer
TSR-065 - Phenolic Trimming Potentiometer
TSR-3590 - Precision Multiturn Wirewound Potentiometer
TSR-105H - 6 Terminal Trimming Potentiometer
Delivery: 2 weeks
Packing information: 50pcs/ tube
MOQ: 500 pcs

A Ball Grid Array makes precise alignment and mounting possible. Before the Ball grid Array packaging, a single circuit board would sometimes require hundreds of pins. This presented a lot of positioning problems. When the assembly was heated, adjacent pins would sometimes get soldered together or form unplanned bridges.

One other advantage of Ball Grid Array packaging over other types of packaging involves heat conduction. A Ball Grid Array has less resistance to heat so heat flows readily from the mounted circuit components to the printed circuit board. This reduces the risk of overheating.

Finally, a Ball Grid Array assembly's contact points (point of contact between the surface solder balls and the printed circuit board itself is not readily apparent. This means greater data and application security.
Of course, a Ball Grid Array packaged integrated circuit is rather inflexible. Rigorous stress on the integrated circuit may cause the balls or the contact points to break off.

The manufacture begins with the basic circuit board, primed and printed. This printed circuit board for BGA has pads made of copper and these are arranged in the grid pattern that the solder balls are designed to have.

After the solder balls have been precisely arranged on the surface of the printed circuit board, the soldering process would begin. Surface mount soldering would proceed through reflow soldering (with the aid of a reflow oven that uses infrared or vapors as the heat source). At this point, the metal alloy balls would melt due to extreme temperatures. As the whole assembly cools, the solder balls will solidify and the package will become firmly affixed to the circuit board.

There is one other common packaging for integrated circuits and this is the PGA or Pin Grid Array. The BGA looks physically similar to a Pin Grid Array package. Both are one-sided; that is, only one face of the semi-conducting substrate is used for printing and mounting of circuit components. Moreover, both have an obvious grid-like pattern. However, the Pin Grid Array uses pins - thus, the name - whereas the BGA uses balls - as it has already been mentioned above. The pins (in the PGA) or the balls (in the BGA) are the materials through which electricity is conducted between the printed surface of the semiconductor board and the surface-mounted circuit components.